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Ordering number : EN*5217
CMOS LSI
LC9949G
1/6" Optical Size EIA B/W Solid-State Image Sensor
Preliminary Overview
The LC9949G is a 1/6" optical size frame transfer type CCD (charge-coupled device) solid-state image sensor developed for use in black-and-white video cameras.
Package Dimensions
unit: mm 3218
[LC9949G]
Features
* Effective number of pixels (total pixels): 384H x 492V (410H x 500V) * Number of optical black pixels: Horizontal direction: Front: 5 pixels Back: 21 pixels Vertical direction: Front: 5 pixels Back: 3 pixels * Dummy bits: Horizontal direction: 4 pixels * Horizontal resolution: 280 TV lines * Supports miniature, compact camera designs. * Package: 20-pin half-pitch transparent DIP * Horizontal shift register: 5 V drive * Supports variable-speed electronic shutter operation
Device Structure
* * * * * 1/6" type frame transfer CCD image sensor Unit cell size: 6.5 m (H) x 3.8 m (V) Chip size: 3.79 mm (H) x 4.44 mm (V) Parallel gate CCD sensor Built-in high-sensitivity output amplifier
Specifications
Absolute Maximum Ratings at Ta = 25C
Parameter Symbol VDD VGG Maximum supply voltage NSUB-PW NSUB - o1 to o4, oS1 to oS4: Horizontal clock pin Other clock pins Other pins Operating temperature Storage temperature Topr Tstg oR VPW = 0 V VPW = 0 V VPW = 0 V VPW = 0 V VPW = 0 V Conditions Ratings -0.3 to +18 -0.3 to +5 -0.3 to +50 -0.3 to +55 -0.3 to +18 -15 to +18 -0.3 to +10 -10 to +60 -30 to +80 Unit V V V V V V V C C
SANYO Electric Co.,Ltd. Semiconductor Bussiness Headquarters
TOKYO OFFICE Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110-8534 JAPAN
22896HA (OT) No. 5217-1/10
LC9949G Block Diagram
No. 5217-2/10
LC9949G Pin Assignment
Pin Functions
Pin No. 1 2 3 4 5 6 7 8 9 10 Symbol NSUB VPW o4 o3 o2 o1 oR VDD VOUT NSUB Reset gate Supply voltage CCD output N-substrate Image clock N-substrate P-well Function Pin No. 20 19 18 17 16 15 14 13 12 11 Symbol NSUB oS4 oS1 oS2 oS3 oH1 oH2 VOG VGG NSUB Horizontal clock CCD output gate Load gate N-substrate Storage area clock N-substrate Function
No. 5217-3/10
LC9949G
Specifications
Clock Voltage Conditions at Frame frequency = 3.58 MHz
Parameter Imaging block pulses o1, o2, o3, o4 Storage block pulses oS1, oS2 Storage block pulses oS3, oS4 Horizontal transfer pulses oH1, oH2 Reset gate oR Substrate pulse oNSUB Pulse amplitude Low level Pulse amplitude Low level Pulse amplitude Low level Pulse amplitude Low level Pulse amplitude Low level High level Low level Symbol VPIF VLIF VPSL VLSL VPSL VLSL VPH VLH VPR VLR VHSUB*2 VLSUB See Figure 1. *1 Conditions min 14.0 -10.0 14.0 -7.0 14.0 -8.0 4.5 0 4.5 3.6 typ 14.5 -9.5 14.5 -6.5 14.5 -7.5 5.0 0 5.0 4.0 max 15.0 -9.0 15.0 -6.0 15.0 -7.0 5.5 0.5 5.5 4.4 40.0 17.5 18.0 18.5 Unit V V V V V V V V V V V V
Note: 1. Insert 47 pF capacitors as shown in Figure 2. 2. Adjust VHSUB within the range where image degradation does not occur so that the saturated output level is maximized.
Figure 1
Figure 2
No. 5217-4/10
LC9949G Bias Conditions
Parameter P-well Output circuit voltage OG bias Symbol VPW VDD VGG VOG *1 *2 *2 14.5 0.5 4.5 Conditions min typ 0 15.0 0.8 5.0 15.5 1.1 5.5 max Unit V V V V
Note: 1. Design applications so that this level never exceeds the substrate pulse low level VLSUB. 2. These are high-impedance inputs.
DC Characteristics
Parameter DC operating current Symbol IDD Conditions min 0.5 typ 1.5 max 2.5 Unit mA
DC operating current
Note: VP: pulse amplitude VL: low level
Figure 3 Pulse Waveform
tWH typ 167 146 167 146 146 146 146 146 1.36 1.36 62.1 62.1 29 67 67 9.9 4.2 tWL typ 99 120 99 120 120 120 120 120 62.1 62.1 1.36 1.36 104 67 67 16.59* 16.59* tr typ 6.5 6.5 6.5 6.5 6.5 6.5 6.5 6.5 30 30 30 30 3.5 3 3 0.07 0.07 tf typ 6.5 6.5 6.5 6.5 6.5 6.5 6.5 6.5 30 30 30 30 3.5 3 3 0.93 0.93 Reset pulse During horizontal transfers The slice pulse values marked * is in ms units. The shutter pulse values marked * is in ms units. ns The values enclosed in dark lines are in s units and apply during 1H line transfers. ns During frame drive When the frame shift frequency is 3.58 MHz ns During frame drive When the frame shift frequency is 3.58 MHz ns
Symbol o1 o2 o3 o4 oS1 oS2 oS3 oS4 oS1 oS2 oS3 oS4 oR oH1 oH2 oNSUB oNSUB
Conditions
Unit
s s
No. 5217-5/10
LC9949G Imaging Characteristics
Parameter Sensitivity Video signal imbalance Saturated signal Smear Dark signal Gamma characteristics Symbol S VF Vsat SM Vdrk Test method 1 2 3 4 5 * 55C 1 500 0.04 7 Conditions min 110 15 typ max Unit mV % mV % mV --
Note: * When the frame shift frequency is 3.58 MHz and the storage time is 1/60 second
Test Procedures The Sanyo evaluation board must be used for the following tests. 1. Sensitivity Use a CCV31F pattern box (manufactured by Dai Nippon Printing Co., Ltd.) set up at a brightness of 1300 NT and color temperature of 3100K with no pattern. Image the pattern box with an HF16A lens (manufactured by Fujinon) with a 1 mm thick C-500 IR cut filter in front of that lens. Set the lens f-stop to f11 and set the lens to be 50 cm from the pattern box. Measure the CCD output signal from the center of the image with this setup. 2. Uniformity of Output Signal Measure under the following conditions. * Standard drive conditions (See the specifications document.) * Use a 3200K color temperature halogen lamp as the light source. * Use a 1 mm thick C-500 IR cut filter. Set the CCD surface illumination to 7 lux, and divide the image into 45 areas as shown in Figure 4. Measure the average value for each block, and determine the maximum, minimum, and mean of those values. Determine the ratio of the range of the block average values to the mean of the block average values. VF = maximum block average value - minimum block average value mean block average value
Figure 4 3. Saturated Signal Saturate the output signal by removing the lens in the test setup for item 1. Measure the CCD output signal from the center of the image in this state.
No. 5217-6/10
LC9949G 4. Smear * Place a 1/10 V chart in front of the halogen light source as shown in the figure and image that chart. * Adjust the amount of light entering the CCD with ND filters so that the CCD output signal at point A becomes 250 mV. * Remove the ND filter(s) and measure the output value of the CCD output signal from the first line (point B). SM = VB * TND x 100 [%] 250
VB: The amount of smear at point B [mV] TND: The ND filter transmissivity
Figure 5 5. Dark Signal Completely block all light from falling on the CCD element surface and measure the CCD output signal at the center of the image. Here, do not measure the difference between this signal and the optical black section level, but rather measure the difference between this signal and the no signal level that has no pixel information. (See Figure 6.)
Figure 6 Structure of a Single Horizontal Period
No. 5217-7/10
LC9949G CCD B/W Camera Block Diagram
Figure 7 Block Descriptions
OSC Generates the reference frequency for synchronization signal and timing pulse generation: 14.318 MHz Generates the pulses required for video signal processing (SYNC, blanking, and other signals) and the pulses required for CCD drive. Includes a built-in CCD horizontal driver circuit. Provides an electronic iris function Amplifies the above pulses to their stipulated amplitudes to drive the CCD element. Level shift of driving pulse Video signal processing, including sample and hold, clamp, AGC, gamma correction, white clipping, and pedestal addition.
Timing pulse generation IC
Driver IC Level shift circuit Signal-processing IC
No. 5217-8/10
LC9949G Notes on Mounting and Handling 1. Preventing Electrostatic Discharge (ESD) Since CCD sensors are easily destroyed by ESD, the antistatic measures described below should be employed when handling this device. * All tools and personnel must be grounded when handling CCDs. Note that a 1 M resistor should be inserted in series between personnel and ground for safety. (We recommend using wrist straps for personnel grounding.) * Personnel should handle CCD devices with either bare hands or antistatic gloves. Use antistatic materials for work garments. Personnel should wear conductive shoes. * Lay conductive mats on the floor and benches in the workplace so that static charges do not accumulate. * We recommend using ionized air blowers (or other static removal techniques) when handling CCD sensors. * Use antistatic boxes when transporting boards that have CCD sensors mounted on them. * Do not leave packing materials or fittings made from plastic materials (such as Styrofoam) that easily collect static charges on or near workplace tables. * Ground all tools, test equipment, conveyors, soldering irons, and other objects used in the workplace. Inspect grounding regularly to assure that it is complete. * Do not handle this IC in the vicinity of TV monitors or other equipment that generates high static voltages. If unavoidable, install antistatic filters in front of monitor screens and take all other possible antistatic measures. * Static charges accumulate easily in workplaces with a low relative humidity. Manufacturing operations should be carried out in an environment with a relative humidity of at least 50%. 2. Soldering * The CCD package temperature must not exceed 80C. * Since CCD sensors are sensitive to thermal stress as well as ESD, the soldering iron temperature should be under 300C. Aim for a soldering time of 2 seconds per pin. * Use soldering irons that include an adjustable temperature control function that holds the soldering iron tip at a constant temperature. * Be especially careful to assure that the device package temperature does not exceed 80C when repairing or redoing solder joints or when removing CCD sensors from printed circuit boards. 3. Soiling and Contamination Prevention * CCD sensors should be handled in a clean workplace. (A class 1000 level is appropriate.) * Do not touch the package surface and do not allow any object to contact the package surface. Use compressed air to remove any foreign objects (such as dust) that land on the package surface. (We recommend using an ionized air blower if possible.) * Use a cotton swab dipped in ethyl alcohol to remove oily contamination, being especially careful not to scratch the package surface. * Use special-purpose cases to prevent soiling and contamination. Warm or cool CCD sensors in advance to prevent condensation when transporting between rooms with radically differing temperatures. * For CCD sensors that are shipped with protective tape applied, only remove that tape immediately prior to use in an environment in which ESD prevention measures have been fully implemented. Do not reuse protective tape that has been removed from a CCD sensor. 4. Storage * Do not allow sunlight or other bright light to fall on CCD sensors for extended periods. * Since harsh conditions such as high temperatures or high humidities can adversely influence device characteristics, do not use or store these devices in environments with such conditions. Samples should be stored in places where the temperature and humidity fall in normal ranges, i.e., 5 to 35C and 45 to 75% RH. * Since CCD sensors are precision optical components, they should not be subjected to mechanical shocks. * Avoid locations with corrosive atmospheres or high dust levels. * Avoid locations subject to rapid temperature changes. * Do not place heavy objects on top of boxes containing CCD sensors during storage. * Use materials that cannot accumulate static charges for containers used to hold samples. * Do not subject magazines holding CCD sensors to mechanical shocks, since this could adversely influence reliability during mounting due to pin bending and other problems.
No. 5217-9/10
LC9949G 5. Notes on Mounting * Flare can occur if a lens with an optical size larger than 1/5" is used. Consult your Sanyo sales representative in advance when selecting lenses. * This product is mounted in a fully transparent plastic package, and is easily influenced by light that passes through the mounting board from the back to the front. Design end-products to adequately block out extraneous light. 6. Shipping * Do not drop or throw packages containing CCD sensors. * Do not allow packages containing CCD sensors to become wet due to rain or snow. * Protect packages containing CCD sensors from mechanical shock and vibration as much as possible during shipping.
s No products described or contained herein are intended for use in surgical implants, life-support systems, aerospace equipment, nuclear power control systems, vehicles, disaster/crime-prevention equipment and the like, the failure of which may directly or indirectly cause injury, death or property loss. s Anyone purchasing any products described or contained herein for an above-mentioned use shall: Accept full responsibility and indemnify and defend SANYO ELECTRIC CO., LTD., its affiliates, subsidiaries and distributors and all their officers and employees, jointly and severally, against any and all claims and litigation and all damages, cost and expenses associated with such use: Not impose any responsibility for any fault or negligence which may be cited in any such claim or litigation on SANYO ELECTRIC CO., LTD., its affiliates, subsidiaries and distributors or any of their officers and employees jointly or severally. s Information (including circuit diagrams and circuit parameters) herein is for example only; it is not guaranteed for volume production. SANYO believes information herein is accurate and reliable, but no guarantees are made or implied regarding its use or any infringements of intellectual property rights or other rights of third parties. This catalog provides information as of February, 1996. Specifications and information herein are subject to change without notice. PS No. 5217-10/10

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